芯片测试插座,连接器产品 |
|
|
菱美电子专业代理及经销各式IC测试座,IC测试夹具,老化测试座,电源模块测试座,品牌包括:ENPLAS,YAMAICHI,
WELLS-CTI,E-TEC,3M TEXTOOL,TI,PLASTRONICS,ADVANCED INTERCONNECTIONS
球型出脚BGA测试插座,
MERITEC贴片SOP测试插座等.测试座封装含概:BGA,,CSP,PGA,QFN,MLF,LGA,QFP,TSOP,SOP,PLCC,SOJ,TO等
并且可以根据客户需求定制BGA/QFN测试座.无论您是设计,测试,烧录,还是老化,生产,必有一款满足您的要求.
|
 |
|
|
|
 BGA
Socket / BGA测试座/老化座/烧写座
LGA Socket / LGA测试座/
CGA Socket/CGA测试座 |
 |
|
菱美电子提供最全的BGA/LGA/CGA测试/老化插座产品,依托欧洲领先的BGA测试产品生产工艺,为客户提供优质的BGA/CSP/LGA测试插座产品,并可根据客户芯片的规格,提供定制化的服务.BGA测试插座分球形出脚(SMT)和针形出脚两种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA
Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚，定制合适的BGA插座(Available
for any chip size and grid pattern)。
老化插座的工作温度一般为：-55°C~150
°C
 More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
 |
-
Any package
style: ceramic & plastic BGA, CSP, LGA, CGA,
PSGA, MLF/QFN,QFP, SOIC, and other standard
packages, custom packages or bare die
-
Same
footprint as BGA device.
-
-1dB bandwidth: >14GHz for
compression style; 3GHz for SMD style
-
Inductance: less than 2nH
-
Hundreds of
footprints available from 1.5mm down to 0.50mm
pitch.
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
|
|
QFN
Socket \ MLF socket |
|
|
|
-
Available in .40, .50, .65, .80 and 1.00 mm
pitches
-
Custom pitches down to .30 mm
-
Lidded and Open Top Sockets for 3 mm - 10 mm
packages
-
Hundreds of
footprints available from 1.5mm down to 0.75mm
pitch.
-
Lidded Sockets for 10 - 16 mm packages
-
Center ground pin standard for all sockets
-
Optional copper heat slug available for high
wattage devices
-
Sockets for over 80 different JEDEC standard
footprints
More
Info.. |
|
IC Test and Burn-In Socket - LingMei
Electronic |
|
|
|
|
 |
|
PGA
Socket / PGA测试老化测试座 |
菱美电子提供最全的PGA测试/老化插座,产品分为2.54mm及1.27mm两重规格,品牌包括:3M™
Textool™ ,WELLS-CTI,Advanced
Interconnections及YAMAICHI等.
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
 |
|
|
|
QFP
Socket / QFP老化测试座 |
|
|
|
-
Pin
counts 32 to 304
-
Pitch
sizes 0.4, 0.5, 0.635, 0.65, 0.8 and 1.0mm
-
High
reliability, durability and temperature range
-
Custom
made also available for high pin count and fine
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
 |
|
|
|
SOP
Socket / SOP老化测试座 |
|
|
|
Pin Count:16
to 88
Pitch:0.5
to 1.27
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
 |
|
|
|
TSOP
Socket / TSOP老化测试座 |
|
|
|
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
 |
|
|
|
SOP
Surface Mount Socket |
|
|
|
980020-48-01,980020-48-02
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
  |
|
|
|
DIP
Socket / DIP老化座 |
|
|
|
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
 |
| |
|
SOJ
Socket / SOJ老化测试座 |
|
|
|
|
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
  |
|
PLCC
Socket / PLCC老化测试座 |
|
|
|
More
Info..
|
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
 |
|
SOT
Socket/晶体管测试座/电源模块测试座 |
|
|
|
More
Info.. |
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
 |
|
TO
Socket / TO老化座 |
|
|
|
|
|
IC Test
and Burn-In Socket - LingMei Electronic |
|
|
|
|
 |
 |
